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Umvelisi weziQhagamshelwano zeSitena-i-236-D 700 iiPali zeeProtobhodi eziSolderless-J-Guang

Umvelisi weziQhagamshelwano zeSitena - 236-D 700 iiPali zeeProtobhodi ezingenaSolderless – iJ-Guang Umfanekiso okhoyo
  • Umvelisi weziQhagamshelwano zeSitena-i-236-D 700 iiPali zeeProtobhodi eziSolderless-J-Guang

Inkcazelo emfutshane:

Ibhodi yesonka ye-J-GUANG ineendidi ezintathu: i-breadboard ye-solderless eqhelekileyo, i-transparent solderless, i-breadboard edibeneyo. Banezinto ezimbini zokupakisha: ukupakisha ibhokisi kunye nokupakisha kwetreyi, sinokupakisha iimpahla ngokweemfuno zabathengi. Inkcazo ye-Dielectric Withstanding Voltage: 500V AC(rms) nge-1 Minute. I-Insulation Resistance: 1000MΩ Min Ukuchasana noQhagamshelwano: 100mΩ Max. Uluhlu lobushushu lokuqala: -20°C~+80°C Isigqubuthelo sezinto: Thermoplastic


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Umvelisi weZiqhagamshelo zeSitena - 236-D 700 iiPali zeeProtobhodi eziSolderless – J-Guang Iinkcukacha:

I-saDFD

Ibhodi yesonka ye-J-GUANG ineendidi ezintathu: i-breadboard ye-solderless eqhelekileyo, i-transparent solderless, i-breadboard edibeneyo. Banezinto ezimbini zokupakisha: ukupakisha ibhokisi kunye nokupakisha kwetreyi, sinokupakisha iimpahla ngokweemfuno zabathengi.

Inkcazo

I-Dielectric Withstanding Voltage: 500V AC(rms) nge-1 Minute.

Ukuchasa i-Insulation: 1000MΩ Min

Ukuchasa uQhagamshelwano: 100mΩ Ubukhulu. Eyokuqala

Uluhlu lobushushu: -20°C~+80°C

Izinto eziphathekayo

I-Insulator: Thermoplastic

JG236-D

Imifanekiso yeenkcukacha zemveliso:

Umvelisi weziQhagamshelwano zeSitena-i-236-D 700 iiPali zeeProtobhodi eziSolderless-J-Guang iinkcukacha zemifanekiso

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I-AVX ngoku iSampulu ye-First-Ever Comined IDC / Press-Fit Wire-to-Board Connection System NYSE:AVX | IiReflector zoKhuseleko eziNdleleni
Umvelisi we-Terminal Connectors - 236-D 700 Poles Solderless Protoboards - J-Guang, Imveliso iya kubonelela kuwo wonke umhlaba, njenge: , , ,


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